2:11-cv-03397
Kaneka Corp v. SKC Kolon Pi Inc
I. Executive Summary and Procedural Information
- Case Name: Kaneka Corporation v. SKC Kolon PI, Inc.
- Parties & Counsel:
- Plaintiff: Kaneka Corporation (Japanese Corporation)
- Defendant: SKC Kolon PI, Inc. (Korean Corporation) and SKC, Inc. (Georgia Corporation)
- Plaintiff’s Counsel: Shore Chan Bragalone DePumpo LLP; ADLI Law Group, P.C.
- Case Identification: 1:10-cv-430, E.D. Tex., 07/26/2010
- Venue Allegations: Plaintiff alleges venue is proper because Defendants advertise, market, and sell their products throughout Texas, including in the Eastern District.
- Core Dispute: Plaintiff alleges that Defendants’ polyimide films, and the processes used to make them, infringe five U.S. patents related to the composition and manufacturing of such films.
- Technical Context: The dispute concerns high-performance polyimide films, a critical material in the electronics industry for applications like flexible printed circuit boards due to their unique thermal and mechanical properties.
- Key Procedural History: The complaint does not mention any prior litigation, licensing history, or post-grant proceedings related to the asserted patents.
Case Timeline
| Date | Event |
|---|---|
| 1989-03-14 | ’064 Patent Priority Date |
| 1991-12-24 | ’064 Patent Issue Date |
| 1997-06-11 | ’866 Patent Priority Date |
| 2000-09-11 | ’639 Patent Priority Date |
| 2001-07-24 | ’866 Patent Issue Date |
| 2001-09-28 | ’704 Patent Priority Date |
| 2004-03-15 | ’961 Patent Priority Date |
| 2004-06-08 | ’639 Patent Issue Date |
| 2006-03-28 | ’704 Patent Issue Date |
| Prior to 2010-02-01 | Defendants’ polyimide films sold in the U.S. |
| 2010-04-06 | ’961 Patent Issue Date |
| 2010-07-26 | Complaint Filing Date |
II. Technology and Patent(s)-in-Suit Analysis
U.S. Patent No. 7,018,704 - "Polyimide Film for Flexible Printed Board and Flexible Printed Board Using the Same", Issued March 28, 2006
The Invention Explained
- Problem Addressed: The patent’s background section describes a trade-off in polyimide films used for flexible printed circuits (FPCs). Films with high flexibility (bending property) tend to have a high coefficient of thermal expansion (CTE), which causes warping and curling, while films with low CTE are often fragile and lack flexibility (’704 Patent, col. 1:24-35).
- The Patented Solution: The invention claims to solve this problem by defining a polyimide film with a specific combination of physical properties: an average CTE within a specified range and a "stiffness value" within another specified range. This balance is achieved through a particular chemical composition, namely a polyimide derived from specific amounts of 4,4'-oxydianiline and paraphenylenediamine monomers (’704 Patent, col. 2:48-54; Abstract).
- Technical Importance: Achieving both dimensional stability (from the controlled CTE) and high flexural endurance (from the controlled stiffness) in a single film was important for producing reliable, high-performance FPCs that could withstand manufacturing stresses and use in compact electronic devices (’704 Patent, col. 1:12-18).
Key Claims at a Glance
- The complaint asserts "one or more claims" of the ’704 Patent (Compl. ¶27). Independent claim 1 recites:
- A polyimide film for flexible printed circuit, having
- an average coefficient of thermal expansion of 1.0×10⁻⁵ to 2.5×10⁻⁵ cm/cm/° C. in temperature range of 100° C. to 200° C.
- and a stiffness value of 0.4 to 1.2 g/cm
- where the polyimide is obtained from diamine containing 4,4'-oxydianiline and paraphenylenediamine in a mole ratio of 9/1 to 4/6.
- The complaint does not specify any asserted dependent claims but reserves the right to do so.
U.S. Patent No. 7,691,961 - "Polyimide Film and Use Thereof", Issued April 6, 2010
The Invention Explained
- Problem Addressed: The patent describes how continuous manufacturing processes, particularly those using a tenter furnace, can create anisotropy in a polyimide film. This results in physical properties, such as dimensional stability, varying across the width of the film, a problem referred to as the "bowing phenomenon," which complicates the production of high-quality FPCs (’961 Patent, col. 3:28-40).
- The Patented Solution: The invention is a polyimide film where the physical properties are uniform across the film's entire width. This is achieved by controlling the relationship between the coefficient of linear expansion along the "molecular orientation axis" and the coefficient perpendicular to that axis. The patent defines a "coefficient of linear expansion ratio A" and claims a film where this ratio is maintained within a specific numerical range across the entire width of the film roll (’961 Patent, col. 5:1-12; Abstract).
- Technical Importance: By ensuring uniform physical properties across the film's width, the invention enables more predictable performance during subsequent roll-to-roll processing steps, such as metal lamination and etching, thereby improving the yield and reliability of high-density FPCs (’961 Patent, col. 6:5-12).
Key Claims at a Glance
- The complaint asserts "one or more claims" of the ’961 Patent (Compl. ¶33). Independent claim 1 recites:
- A polyimide film produced by a continuous process,
- wherein when a coefficient of linear expansion "a" in a direction of the molecular orientation axis and a coefficient of linear expansion "b" in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C.,
- a coefficient of linear expansion ratio A represented by the equation A=1+{(b-a)/(b+a)}x2
- is in the range of 1.13 to 3.00 across the entire width.
- The complaint does not specify any asserted dependent claims but reserves the right to do so.
U.S. Patent No. 5,075,064 - "Method and Apparatus for Continuously Producing Resin Films and Installation Therefor", Issued December 24, 1991
- Patent Identification: U.S. Patent No. 5,075,064, "Method and Apparatus for Continuously Producing Resin Films and Installation Therefor," Issued December 24, 1991 (Compl. ¶38).
- Technology Synopsis: The patent addresses the problem of surface defects like "wind ripples" that form on resin films when hardened by conventional hot air jets (’064 Patent, col. 1:24-35). The patented solution is a two-stage hardening method where the cast resin is first pre-hardened to a non-fluid state using a gas stream parallel to the film, and only then is it fully hardened using a perpendicular jet of gas (’064 Patent, col. 2:56-68).
- Asserted Claims: The complaint asserts "one or more claims" (Compl. ¶39); independent claim 1 is representative.
- Accused Features: The complaint alleges that the process for making Defendants' IN, IF, LV, and LN polyimide films infringes the patent (Compl. ¶39).
U.S. Patent No. 6,264,866 - "Method for Producing Polyimide Film", Issued July 24, 2001
- Patent Identification: U.S. Patent No. 6,264,866, "Method for Producing Polyimide Film," Issued July 24, 2001 (Compl. ¶43).
- Technology Synopsis: The patent seeks to solve the problem of inconsistent adhesive properties in finished polyimide films, which conventional after-treatments fail to address reliably (’866 Patent, col. 1:41-49). The invention is a production method where the adhesive strength of the final film is controlled during manufacturing by adjusting the "imidation ratio" and/or the amount of "volatile constituent" of the film at an intermediate "prefilm" stage, prior to final curing (’866 Patent, Abstract; col. 2:3-9).
- Asserted Claims: The complaint asserts "one or more claims" (Compl. ¶44); independent claim 1 is representative.
- Accused Features: The complaint alleges that the process for making Defendants' IN, IF, LV, and LN polyimide films infringes the patent (Compl. ¶44).
U.S. Patent No. 6,746,639 - "Process for Preparing Polyimide Film", Issued June 8, 2004
- Patent Identification: U.S. Patent No. 6,746,639, "Process for Preparing Polyimide Film," Issued June 8, 2004 (Compl. ¶49).
- Technology Synopsis: The patent addresses the challenge of preventing bubble inclusion and uneven thickness when casting polyimide films from high-viscosity solutions, particularly at high speeds, without degrading the film's mechanical strength (’639 Patent, col. 3:1-13). The patented process uses a low-viscosity poly(amic acid) varnish, achieved through specific non-equimolar monomer ratios, combined with specific amounts of a dehydrating agent and a catalyst just before casting (’639 Patent, Abstract; col. 4:1-24).
- Asserted Claims: The complaint asserts "one or more claims" (Compl. ¶50); independent claim 1 is representative.
- Accused Features: The complaint alleges that the process for making Defendants' IN, IF, LV, and LN polyimide films infringes the patent (Compl. ¶50).
III. The Accused Instrumentality
Product Identification
The accused instrumentalities are polyimide films identified by Defendants as product types IN, IF, LV, and LN (Compl. ¶23).
Functionality and Market Context
The complaint alleges these are polyimide films used in the United States (Compl. ¶¶16-17). The central allegation of infringement is based on the results of "laboratory tests" performed by Kaneka on samples of the accused films (Compl. ¶¶21, 24). The complaint alleges that these films were purchased by customers of Kaneka's own U.S. subsidiary, suggesting the parties are direct competitors in the U.S. market (Compl. ¶18). The complaint does not provide specific details on the technical operation or composition of the accused films, resting instead on the conclusion that its testing confirms they "fall within the scope of the claimed inventions" (Compl. ¶24). No probative visual evidence provided in complaint.
IV. Analysis of Infringement Allegations
The complaint does not provide claim charts or detailed infringement theories, stating only that its laboratory tests confirm that Defendants' products infringe (Compl. ¶24). The following tables summarize a potential infringement theory for a representative claim of each lead patent based on the complaint's general allegations.
'704 Patent Infringement Allegations
| Claim Element (from Independent Claim 1) | Alleged Infringing Functionality | Complaint Citation | Patent Citation |
|---|---|---|---|
| A polyimide film for flexible printed circuit, having an average coefficient of thermal expansion of 1.0x10⁻⁵ to 2.5x10⁻⁵ cm/cm/° C. in temperature range of 100° C. to 200° C. | The complaint alleges, based on laboratory testing, that the accused IN, IF, LV, and LN polyimide films have a coefficient of thermal expansion within this range. | ¶23-24, ¶27 | col. 2:40-44 |
| and a stiffness value of 0.4 to 1.2 g/cm | The complaint alleges, based on laboratory testing, that the accused films have a stiffness value within this range. | ¶23-24, ¶27 | col. 2:7-10 |
| where the polyimide is obtained from diamine containing 4,4'-oxydianiline and paraphenylenediamine in a mole ratio of 9/1 to 4/6. | The complaint alleges, based on laboratory testing, that the accused films are made from these specific monomers in the claimed ratio. | ¶23-24, ¶27 | col. 3:9-14 |
- Identified Points of Contention:
- Evidentiary Question: The complaint's infringement theory is entirely dependent on confidential "laboratory tests" (Compl. ¶¶21-24). A central issue will be whether discovery validates these tests and confirms that Defendants' products actually meet the specific quantitative limitations for CTE, stiffness, and chemical composition required by the claims.
- Methodological Question: Disputes may arise over the specific methodologies used to measure the "stiffness value" and "average coefficient of thermal expansion," and whether those methods align with the procedures contemplated by the patent's specification and examples.
'961 Patent Infringement Allegations
| Claim Element (from Independent Claim 1) | Alleged Infringing Functionality | Complaint Citation | Patent Citation |
|---|---|---|---|
| A polyimide film produced by a continuous process, | The complaint alleges the accused films are produced by a continuous process that results in the claimed properties. | ¶24, ¶33 | col. 10:35-37 |
| wherein...a coefficient of linear expansion ratio A represented by equation (1)...is in the range of 1.13 to 3.00 across the entire width. | The complaint alleges, based on laboratory testing, that the accused films meet this specific mathematical relationship between their coefficients of linear expansion across their entire width. | ¶23-24, ¶33 | col. 5:1-5 |
- Identified Points of Contention:
- Process Evidence: The claim is for a "polyimide film produced by a continuous process" having certain properties. This raises the evidentiary question of what proof Plaintiff has regarding Defendants' actual manufacturing process, beyond inferences drawn from analyzing the final product.
- Measurement and Definition: Infringement of this claim hinges on precise measurements of CTE along and perpendicular to a "molecular orientation axis." A likely point of contention will be the proper method for identifying this axis in an accused product and whether the measurement techniques used are consistent with those described in the patent.
V. Key Claim Terms for Construction
For the ’704 Patent:
- The Term: "stiffness value"
- Context and Importance: This term is a critical quantitative limitation for infringement. As the patent ties this value to the film's flexural endurance, its precise definition and method of measurement will be central to determining whether the accused products, which compete in the same FPC market, fall within the claim scope. Practitioners may focus on this term because infringement depends on meeting the specific 0.4 to 1.2 g/cm range.
- Intrinsic Evidence for Interpretation:
- Evidence for a Broader Interpretation: The claim language itself does not specify a measurement technique, which may support the use of any industry-standard method for determining stiffness that would have been known to a person of ordinary skill in the art.
- Evidence for a Narrower Interpretation: The specification describes measuring the value using a specific apparatus: "a loop stiffness tester made by Toyo Seiki Works Co., Ltd" (’704 Patent, col. 6:1-4). A party could argue that the term should be construed as being limited to the results obtained from this specific type of test under the conditions described in the patent's examples.
For the ’961 Patent:
- The Term: "molecular orientation axis"
- Context and Importance: The entire calculation for the dispositive "coefficient of linear expansion ratio A" is dependent on first identifying this axis. The term's construction is crucial because an ambiguous or non-reproducible definition would render the claim indefinite. Practitioners may focus on this term because the infringement analysis for the entire claim begins with its determination.
- Intrinsic Evidence for Interpretation:
- Evidence for a Broader Interpretation: The specification provides a functional definition as "the direction of the highest degree of molecular orientation in the X-Y plane of the polyimide film" (’961 Patent, col. 8:10-13), which is not explicitly tied to one particular machine or method.
- Evidence for a Narrower Interpretation: The specification discloses using a specific piece of equipment to perform the measurement, a "molecular orientation analyzer, e.g., trade name: MOA 2012A" (’961 Patent, col. 8:18-21). This may support an argument that the term's meaning is limited by the capabilities and outputs of the disclosed measurement technology.
VI. Other Allegations
- Indirect Infringement: The complaint includes conclusory allegations of induced and contributory infringement for all five asserted patents (e.g., Compl. ¶¶27, 33, 39, 44, 50). It does not, however, plead any specific facts to support these claims, such as the existence of instructive materials provided by Defendants or the absence of substantial non-infringing uses for the accused products.
- Willful Infringement: Willfulness is alleged for all five patents "on information and belief" (e.g., Compl. ¶¶29, 35, 46, 52). The complaint does not assert any facts indicating pre-suit knowledge by the Defendants, such as prior notice from Kaneka. The basis for willfulness appears to be an allegation of continued infringement after the filing of the complaint.
VII. Analyst’s Conclusion: Key Questions for the Case
- A central issue will be one of evidentiary proof: The complaint's infringement allegations for all five patents rest entirely on the undisclosed results of "laboratory tests." The case will likely turn on whether the evidence produced in discovery substantiates these conclusory claims and proves, under the relevant legal standards, that the accused products meet the specific compositional and property-based limitations of the product claims and are made by the methods recited in the process claims.
- A key challenge for the plaintiff will be one of process verification: Four of the five asserted patents claim manufacturing methods or products defined by their process. A core question is whether Kaneka can obtain sufficient evidence, through reverse engineering or discovery into SKC's proprietary operations, to prove that Defendants' manufacturing lines practice the specific steps of the asserted method claims, such as the two-stage gas hardening ('064) or the prefilm property control ('866).
- A dispositive battleground may be one of definitional measurement: The infringement analysis for the product claims hinges on quantitative metrics like "stiffness value" ('704) and "coefficient of linear expansion ratio" ('961). The case may therefore depend on the court's construction of these terms and the specific, reproducible methodologies required to measure them, raising the question of whether the parties' testing methods will align with the court's interpretation.