NXP Semiconductors NV v. Bell Seminconductor LLC

Bruce W. Slayden, II

Truman H. Fenton

Tecuan Flores

Hong A. Zhong

Prosecution History analysis

Examiner Search analysis

Invalidity Framework analysis

IC package substrate patent faces obviousness challenge to all 19 claims. Chin prior art cited for using metal cutouts to reduce parasitic capacitance.

NXP BV

NXP USA Inc

Bell Semiconductor LLC

NXP Semiconductors NV

Last Docket Entry Date

Total Docket Entries

IPR2021-00966 | NXP Semiconductors NV v. Bell Seminconductor LLC | Ex Parte

Patent Trial and Appeal Board

Judge	Cases	Inst. Rate	FWD Inv. Rate
Jeffrey W Abraham	400+	59%	85%
Jo-Anne M Kokoski	600+	55%	74%
Juliet M Dirba	200+	68%	85%
Juliet M Dirba	200+	68%	85%

Name	Ratings
NXP Semiconductors NV	L4 A
NXP USA Inc	L4 A
NXP BV	L4 A

Name	Ratings
Slayden Grubert Beard PLLC	L1 C
Bruce W. Slayden, II	L2 C
Truman H. Fenton	-- -- --
Tecuan Flores	-- -- --

Name	Ratings
Irell & Manella LLP	L5 A
Hong A. Zhong	L4 A