US 10,164,143 B2
OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPSGeneral
US 10,164,143 B2
OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Ali Naraghi
Art Unit:
2896 Semiconductors/Memory
Agent:
Inventors:
Karl Engl; Anna Kasprzak-Zablocka; Markus Maute; Stefanie Rammelsberger
Assignee:
Priority:
02/07/12
Filed:
07/27/17
Granted:
12/25/18
Expiration:
02/07/32
Abstract
An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. The first semiconductor layer is disposed on the side of the active region facing the substrate. The first semiconductor layer is electrically conductively connected to a first termination layer that is disposed between the substrate and the semiconductor body. An encapsulation layer is disposed between the first termination layer and the substrate and, in plan view of the semiconductor chip, projects at least in some regions over a side face which delimits the semiconductor body.
Cooperative Patent Classification (CPC)
H10H10H20/8314H10H