US 10,509,446 B2 | COOLING APPARATUS FOR ELECTRONIC COMPONENTS

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US 10,509,446 B2

COOLING APPARATUS FOR ELECTRONIC COMPONENTS

Tech Center:

3700 Mechanical Engineering, Manufacturing and Medical Devices/Processes

Examiner:

J. Todd Newton

Art Unit:

3745 Thermal and Combustion Technology, Motive and Fluid Power Systems

Agent:

McDermott Will & Emery LLP

Inventors:

Shui-Fa TSAI; Fu-Lung LIN

Assignee:

CMI USA, INC.

Priority:

12/30/16

Filed:

12/30/16

Granted:

12/17/19

Expiration:

12/17/37

Abstract

A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.

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