US 10,629,486 B2
METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIPGeneral
US 10,629,486 B2
METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Niki H Nguyen
Art Unit:
2818 Semiconductors/Memory
Inventors:
Michael Huber; Lorenzo Zini
Assignee:
OSRAM OLED GMBH
Priority:
01/11/16
Filed:
07/18/17
Granted:
04/21/20
Expiration:
01/11/36
Abstract
According to the present disclosure, a method for producing a plurality of semiconductor chips is provided with the following steps: a) providing a composite assembly, including a carrier, a semiconductor layer sequence and a functional layer; b) severing the functional layer by means of coherent radiation along a singulation pattern; c) forming separating trenches in the carrier along the singulation pattern; and d) applying a protective layer, which delimits the functional layer toward the separating trenches, on in each case at least one side surface of the semiconductor chips to be singulated. The singulated semiconductor chips each includes a part of the semiconductor layer sequence, of the carrier and of the functional layer.
Cooperative Patent Classification (CPC)
H01H01L23/3171H01LH10H20/84H10H