US 11,061,450 B2
COOLING APPARATUS FOR ELECTRONIC COMPONENTSGeneral
US 11,061,450 B2
COOLING APPARATUS FOR ELECTRONIC COMPONENTS
Tech Center:
3700 Mechanical Engineering, Manufacturing and Medical Devices/Processes
Examiner:
J. Todd Newton
Art Unit:
3745 Thermal and Combustion Technology, Motive and Fluid Power Systems
Inventors:
Shui-Fa TSAI; Fu-Lung LIN
Assignee:
Priority:
12/30/16
Filed:
10/23/19
Granted:
07/13/21
Expiration:
12/30/36
Abstract
A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.
Cooperative Patent Classification (CPC)
H01H01L23/3736H01LG06F2200/201G06F