US 6,097,061 A
Trenched gate metal oxide semiconductor device and methodGeneral
US 6,097,061 A
Trenched gate metal oxide semiconductor device and method
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Sheila V. Clark
Art Unit:
2815 Semiconductors/Memory
Agent:
Inventors:
LIU W. YOWJUANG; DONALD L. WOLLESEN
Assignee:
Priority:
03/30/98
Filed:
03/30/98
Granted:
08/01/00
Expiration:
03/30/18
Abstract
A Metal Oxide Semiconductor (MOS) transistor and method for improving device scaling comprises a trenched polysilicon gate formed within a trench etched in a semiconductor substrate and further includes a source region, a drain region, and a channel region. The source and drain region are laterally separated by the trench in which the trenched polysilicon gate is formed and partially extend laterally beneath the bottom surface of the trench. The channel region is formed in the silicon substrate beneath the bottom surface of the trench. In one embodiment, the top surface of the trenched polysilicon gate is substantially planar to the substrate surface. In another embodiment, the top surface and a portion of the trenched polysilicon gate are disposed above the substrate surface.