US 6,354,479 B1
Dissipative ceramic bonding tipGeneral
US 6,354,479 B1
Dissipative ceramic bonding tip
Tech Center:
1700 Chemical and Materials Engineering
Examiner:
Tom Dunn
Art Unit:
1725 Fuel Cells, Batteries, Solar Cells, Liquid Crystal Composition
Agent:
Inventors:
Steven Frederick Reiber; Mary Louise Reiber
Assignee:
Priority:
02/25/99
Filed:
02/25/00
Granted:
03/12/02
Expiration:
02/25/20
Abstract
Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present invention, to avoid damaging delicate electronic devices by any electrostatic discharge, an ultrasonic bonding wedge tool tip must conduct electricity at a rate sufficient to prevent charge buildup, but not at so high a rate as to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 105 to 1012 ohms. In addition, the wedges must also have specific mechanical properties to function satisfactorily.