US 6,411,512 B1
High performance cold plateGeneral
US 6,411,512 B1
High performance cold plate
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Gregory Thompson
Art Unit:
2835 Electrical Circuits and Systems
Agent:
Inventors:
Magda Mankaruse; Nagui F. Mankaruse
Assignee:
Priority:
06/29/99
Filed:
11/21/00
Granted:
06/25/02
Expiration:
06/29/19
Abstract
A cold plate assembly for cooling a heat source is disclosed. The cold plate assembly includes a rectangular base having an inner surface for thermally interfacing with the heat source. Machining or casting or molding a contour to interface with the heat source forms the base. A heat pipe thermal plane or individual heat pipes are selected to conform to the thermal cooling capacity of the cold plate assembly. One or two compact heat exchangers are selected to remove the heat conducted through the base to the cooling fluid used in the compact heat exchanger. The three modules are bonded together to form the cold plate assembly.