US 6,965,499 B1
Head suspension configured for improved thermal performance during solder ball bonding to head sliderGeneral
US 6,965,499 B1
Head suspension configured for improved thermal performance during solder ball bonding to head slider
Tech Center:
2600 Communications
Examiner:
A. J. Heinz
Art Unit:
2653 Videophones and Telephonic Communications; Audio Signals; Digital Audio Data Processing; Linguistics, Speech Processing and Audio Compression
Agent:
Inventors:
Yiduo Zhang; Raymond R. Wolter; Craig A. Leabch
Assignee:
Priority:
04/25/02
Filed:
04/23/03
Granted:
11/15/05
Expiration:
07/13/22
Abstract
A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.