US 7,100,679 B2
Integrated circuit heat pipe heat spreader with through mounting holesGeneral
US 7,100,679 B2
Integrated circuit heat pipe heat spreader with through mounting holes
Tech Center:
3700 Mechanical Engineering, Manufacturing and Medical Devices/Processes
Examiner:
Ljiljana Ciric
Art Unit:
3753 Fluid Handling and Dispensing
Agent:
Inventors:
Peter M. Dussinger; Thomas L. Myers
Priority:
05/12/99
Filed:
12/18/03
Granted:
09/05/06
Expiration:
10/16/19
Abstract
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.
Cooperative Patent Classification (CPC)
H01H01L2924/0002H01LF28D15/0233F28D