Flip chip bonding tool and ball placement capillary

A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.

ELECTRIC ELEMENTS

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Wire connectors; Manufacturing methods related thereto-Structure, shape, material or disposition of the wire connectors prior to the connecting process-of an individual wire connector-Core members of the connector-Material-with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof-the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C-Aluminium (Al) as principal constituent

SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Nitrides composed of metals from groups of the periodic table-4th Group-TiN

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto-Apparatus for manufacturing means for bonding, e.g. connectors-Apparatus for manufacturing bump connectors

MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR

Articles made by soldering, welding or cutting-Electric or electronic devices-Semiconductor devices

SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Bump connectors; Manufacturing methods related thereto-Structure, shape, material or disposition of the bump connectors prior to the connecting process-of an individual bump connector-Core members of the bump connector-Material

Soldering, e.g. brazing, or unsoldering -specially adapted for particular articles or work-Brazing of electronic components

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Arsenic [As]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Tungsten [W]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Rhenium [Re]

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods -Auxiliary devices therefor 

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Wire connectors; Manufacturing methods related thereto-Structure, shape, material or disposition of the wire connectors after the connecting process-of an individual wire connector

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Boron [B]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Titanium [Ti]

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods -Solder feeding devices; Solder melting pans-Solder feeding devices-for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Zirconium [Zr]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Cobalt [Co]

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Bump connectors ; ; Manufacturing methods related thereto-Manufacturing methods 

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Gold [Au]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Details of semiconductor or other solid state devices to be connected-Device type-Integrated circuits

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Bump connectors ; ; Manufacturing methods related thereto-Structure, shape, material or disposition of the bump connectors prior to the connecting process-of an individual bump connector

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Platinum [Pt]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Alloys-Solder alloys

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Bump connectors; Manufacturing methods related thereto-Structure, shape, material or disposition of the bump connectors prior to the connecting process-of an individual bump connector-Core members of the bump connector-Material-with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof-the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C-Gold [Au] as principal constituent

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto-Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies-Apparatus for manufacturing means for bonding, e.g. connectors-Apparatus for manufacturing bump connectors

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Neodymium [Nd]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Technical content checked by a classifier-the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Bump connectors; Manufacturing methods related thereto-Manufacturing methods-by local deposition of the material of the bump connector-in solid form-Stud bumping, i.e. using a wire-bonding apparatus

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Lead [Pb]

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Details of semiconductor or other solid state devices to be connected-Device type-Passive devices, e.g. 2 terminal devices-Optical Diode-LASER

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00-Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, 'first-level' interconnects; Manufacturing methods related thereto-Bump connectors; Manufacturing methods related thereto-Structure, shape, material or disposition of the bump connectors after the connecting process-of an individual bump connector

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00-Chemical elements-Aluminum [Al]

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