US 7,238,550 B2
Methods and apparatus for fabricating Chip-on-Board modulesGeneral
US 7,238,550 B2
Methods and apparatus for fabricating Chip-on-Board modules
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
David A. Zarneke
Art Unit:
2891 Semiconductors/Memory
Inventors:
Charles I. Peddle
Assignee:
HELIX MICRO INNOVATIONS LLC
Priority:
02/20/03
Filed:
02/20/03
Granted:
07/03/07
Expiration:
11/27/22
Abstract
An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a printed circuit board using one or more selectively settable materials, testing and patching the memory parts, and providing a protective cover after a suitable combination of memory parts and patches produces a fully-functional memory module. Also, a new set of printed circuit boards designed to allow fabrication of memory modules using single-bit patching, any-bit patching, and DDR technology with unpackaged memory parts. In a preferred embodiment, the method and printed circuit boards mentioned above are combined to produce a number of low-cost memory modules using modern, available partially-defective and flawless memory parts.
Cooperative Patent Classification (CPC)
B82B82Y10/00B82YH01L2224/05599H01LH05K2201/10159H05KY10T29/4913Y10TG11C29/022G11C