US 7,709,900 B2
Semiconductor deviceGeneral
US 7,709,900 B2
Semiconductor device
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Phat X Cao
Art Unit:
2814 Semiconductors/Memory
Inventors:
Daisaku Ikoma; Atsuhiro Kajiya; Katsuhiro Ootani; Kyoji Yamashita
Assignee:
Priority:
07/22/04
Filed:
08/20/07
Granted:
05/04/10
Expiration:
10/08/25
Abstract
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
Cooperative Patent Classification (CPC)
H10H10D84/0149H10DH01L21/76895H01L