US 7,781,679 B1
Disk drive suspension via formation using a tie layer and productGeneral
US 7,781,679 B1
Disk drive suspension via formation using a tie layer and product
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Xiaoliang Chen
Art Unit:
2841 Electrical Circuits and Systems
Agent:
Intellectual Property Law Offices of Joel Voeizke, APC
Inventors:
Christopher Schreiber; Christopher Dunn
Assignee:
Priority:
09/09/05
Filed:
01/26/06
Granted:
08/24/10
Expiration:
04/13/28
Abstract
A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.
Cooperative Patent Classification (CPC)
H05H05K2201/09827H05KY10T428/31678Y10T