US 7,923,644 B2
Printed circuit board and method of manufacturing the sameGeneral
US 7,923,644 B2
Printed circuit board and method of manufacturing the same
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Ishwarbhai B Patel
Art Unit:
2835 Electrical Circuits and Systems
Inventors:
Jun ISHII; Toshiki NAITOU; Mitsuru HONJO
Assignee:
Priority:
11/10/08
Filed:
11/03/09
Granted:
04/12/11
Expiration:
12/03/28
Abstract
A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.
Cooperative Patent Classification (CPC)
H05H05K2201/09554H05KG11B5/486G11BY10T29/49155Y10T