US 8,431,937 B2
SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMICONDUCTOR CHIPGeneral
US 8,431,937 B2
SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMICONDUCTOR CHIP
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Matthew Landau
Art Unit:
2813 Semiconductors/Memory
Agent:
Inventors:
Uwe Strauss
Assignee:
OSRAM OLED GMBH
Priority:
04/17/09
Filed:
04/17/09
Granted:
04/30/13
Expiration:
11/27/29
Abstract
A semiconductor chip includes a carrier and a semiconductor body, which includes a semiconductor layer sequence having an active region provided for generating radiation. The carrier has a first carrier area facing the semiconductor body and a second carrier area remote from the semiconductor body. The semiconductor body is cohesively fixed to the carrier by means of a connection layer. A plurality of reflective or scattering elements are formed between the second carrier area and the active region.
Cooperative Patent Classification (CPC)
H10H10H20/018H10H