US 8,530,250 B2
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyGeneral
US 8,530,250 B2
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Caridad Everhart
Art Unit:
2895 Semiconductors/Memory
Agent:
Inventors:
Hirofumi Ichikawa; Masaki Hayashi; Shimpei Sasaoka; Tomohide Miki
Assignee:
Priority:
09/03/08
Filed:
08/27/09
Granted:
09/10/13
Expiration:
09/11/29
Abstract
Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).
Cooperative Patent Classification (CPC)
H01H01L2224/48247H01LH10H20/8506H10HB29C2793/009B29C