US 9,537,071 B2
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyGeneral
US 9,537,071 B2
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
Tech Center:
2800 Semiconductors/Memory, Circuits/Measuring and Testing, Optics/Photocopying, Printing/Measuring and Testing
Examiner:
Caridad Everhart
Art Unit:
2895 Semiconductors/Memory
Agent:
Inventors:
Hirofumi ICHIKAWA; Masaki HAYASHI; Shimpei SASAOKA; Tomohide MIKI
Assignee:
Priority:
09/03/08
Filed:
10/30/15
Granted:
01/03/17
Expiration:
08/27/29
Abstract
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
Cooperative Patent Classification (CPC)
B29B29C2793/009B29CH01L2224/48091H01LH10H20/8506H10H