US 9,629,265 B2
COOLING STRUCTURE OF ELECTRONIC DEVICEGeneral
US 9,629,265 B2
COOLING STRUCTURE OF ELECTRONIC DEVICE
Tech Center:
3700 Mechanical Engineering, Manufacturing and Medical Devices/Processes
Examiner:
Helena Kosanovic
Art Unit:
3749 Thermal and Combustion Technology, Motive and Fluid Power Systems
Agent:
Inventors:
Yorito NAGASAKA
Assignee:
Priority:
02/28/13
Filed:
02/28/13
Granted:
04/18/17
Expiration:
09/01/34
Abstract
A cooling structure is designed for an electronic device including a plurality of fans causing cooling air, a plurality of electronic parts serving as heat sources, and a plurality of power source units, all of which are arranged inside the housing. The electronic parts are positioned in the downstream side of cooling air produced by the fans, while the power source units are positioned in the further downstream side of cooling air compared to the electronic parts. The power source units are spaced out from each other in the perpendicular direction to the cooling airflow direction of cooling air such that the power source units do not overlap with the electronic parts in the cooling airflow direction in plan view. The cooling structure prevents cooling air, which is temporarily warmed by the electronic parts, from directly flowing into the power source units, thus improving a cooling effect.
Cooperative Patent Classification (CPC)
H05H05K7/20145H05K