US RE40,264 E1
Multi-temperature processingGeneral
US RE40,264 E1
Multi-temperature processing
Tech Center:
1700 Chemical and Materials Engineering
Examiner:
Anita Alanko
Art Unit:
1765 Organic Chemistry, Polymers, Compositions
Inventors:
Daniel L. Flamm
Assignee:
--
Priority:
12/04/95
Filed:
05/14/03
Granted:
04/29/08
Expiration:
12/04/15
Abstract
The present invention provides a technique, including a method and apparatus, for etching a substrate in the manufacture of a device. The apparatus includes a chamber and a substrate holder disposed in the chamber. The substrate holder has a selected thermal mass to facilitate changing the temperature of the substrate to be etched during etching processes. That is, the selected thermal mass of the substrate holder allows for a change from a first temperature to a second temperature within a characteristic time period to process a film. The present technique can, for example, provide different processing temperatures during an etching process or the like.