Gerald F. Ivey

Christine Yang

Melissa R. Smith

Benjamin Schlesinger

Otis W. Carroll, Jr.

Collin M. Maloney

Charles H. Suh

Parmanand K. Sharma

Jinwoo Kim

Mandy C. Nelson

Shawn S. Chang

Chen Zang

Wyatt L. Bazrod

Alfred R. Fabricant

Samuel F. Baxter

William E. Davis, III

Peter Lambrianakos

Jennifer L. Truelove

Vincent J. Rubino, III

Joseph M. Mercadante

Richard M. Cowell

Rudolph Fink, IV

Ty William Wilson

Samsung hit with patent lawsuit over microscopic chip structures in its flagship smartphones, targeting unique "anchor via" and "trench chamfered corner" tech.

Prosecution History analysis

Examiner Search analysis

Invalidity Framework analysis

Name	Ratings
McKool Smith	L5 E
Samuel F. Baxter	L5 A
Jennifer L. Truelove	L5 E
Davis FirmLocal	L3 E
William E. Davis, III	L5 E
Ty William Wilson	L1 D
Rudolph Fink, IV	-- -- --
Fabricant LLPLocal	L2 D
Alfred R. Fabricant	L3 D
Peter Lambrianakos	L3 D
Vincent J. Rubino, III	L3 D
Richard M. Cowell	L1 D
Joseph M. Mercadante	L1 D

Name	Ratings
Samsung Electronics Co Ltd	L5 A
Samsung Electronics America Inc	L5 A

Name	Ratings
Gillam & Smith LLPLocal	L5 A
Melissa R. Smith	L5 A
Finnegan Henderson Farabow Garrett & Dunner LLP	L5 A
Gerald F. Ivey	L5 B
Christine Yang	L5 E
Charles H. Suh	L3 A
Parmanand K. Sharma	L3 A
Benjamin Schlesinger	L2 D
Shawn S. Chang	L1 C
Jinwoo Kim	L1 E
Chen Zang	-- -- --
Wyatt L. Bazrod	-- -- --
Carroll Maloney Henry & NelsonLocal	L4 A
Otis W. Carroll, Jr.	L5 A
Collin M. Maloney	L5 B
Mandy C. Nelson	-- -- --

2:24-cv-00140

Harbor Island Dynamic LLC v. Samsung Electronics Co Ltd