Qualcomm Inc v. DSS Technology Management Inc

David L. McCombs

Qualcomm challenges semiconductor interconnect patent: 8 claims face anticipation by Sakamoto & obviousness over Cederbaum’s metal plug technology.

Judge	Cases	Inst. Rate	FWD Inv. Rate
Brian J McNamara	800+	69%	88%
Bryan F Moore	600+	60%	84%
Minn Chung	300+	58%	89%

Name	Ratings
Qualcomm Inc	L3 C
GlobalFoundries US Inc	L3 A
GlobalFoundries Inc	L3 A
GlobalFoundries Dresden Module Two LLC	L3 A
GlobalFoundries Dresden Module One LLC	L3 A
Intel Corp	L3 E

Name	Ratings
Haynes & Boone LLP	L5 B
David L. McCombs	L5 A
David M. O'Dell	L4 C
Wilmer Cutler Pickering Hale Dorr LLP	L5 E
Grant K. Rowan	L2 C
Yung-Hoon Ha	-- -- --